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            正邦科技(002157)融资融券信息(11-20)

            admin 2019-12-28 264人围观 ,发现0个评论

             

            正邦科技(002157)2019-11-20融资融券信息显现,正邦科技融资余额1,722,627,602元,融券余额32,632,399元,融资买入额70,397,092元,融资归还额71,540,669元,融资净买额-1,143,577元,融券余量2,161,086股,融券卖出量92,700股,融券归还量559,700股,融资融券余额1,755,260,001元。正邦科技融资融券详细信息如下表:

            买卖日期代码简称融资融券余额(元)
            2019-11-20002157正邦科技1,755,260,001
            融资余额(元)融资买入额(元)融资归还额(元)融资净买额(元)正邦科技(002157)融资融券信息(11-20)
            1,722,627,60270,397,09271,540,669-1,143,577
            融券余额(元)正邦科技(002157)融资融券信息(11-20)融券余量(股)融券卖出量(股)融券归还量(股)
            32,632,3992,161,08692,700559,700

            深市正邦科技(002157)融资融券信息(11-20)悉数融资融券数据一览 正邦科技融资gray融券数据

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